SOI wafer bonding

From WikiCover

On July 18, 2007, SUSS MicroTec announced the launch of its new 300 mm silicon-on-insulator (SOI) wafer bonding system, the ELAN CBC300SOI.

At the core of the cluster tool's improved throughput capabilities is a single-station bond technology that allows for 300mm cleaning, aligning, and bonding to occur within a single process module. Single-station bonding eliminates wafer handling between each step in the bonding process, improving cleanliness and productivity.

Advanced cleaning technologies ensure void-free bonding. A unibody dual-nozzle megasonic cleaner and programmable IR-assisted spin drying result in extremely clean wafers and controlled surface drying. Within Sthe single-station bond module, infrared heating of wafers means customers can now control their clean and dry parameters for repeatable wafer bonding results.

The standard system includes two single station bond modules, a high-resolution IR inspection module, a central material handling unit with a robust wafer handling robot and precise prealigner, and two loadports – all within a small cleanroom footprint.