SUSS MicroTec

From WikiCover

SUSS MicroTec supplies production, process, and test technology for the semiconductor industry. SUSS maintains its leadership position with over seven thousand systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, wafer bonders, flip-chip bonders, probe systems and now equipment for C4NP production. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan.

For over ten years, SUSS MicroTec has continued to advance the state-of-the-art in wafer bonding technology for the MEMS, SOI, 3-D interconnect, and Opto-Electronic markets, setting new standards for development as well as high-volume production. The company's core competence – engineering and design – is constantly leveraged to develop technology solutions that most effectively support standard bonding processes as well as the most critical, leading-edge applications. SUSS MicroTec's wafer bonding solution set includes manual, semi-automated, and fully automated cluster systems.

Website: http://www.suss.com/